SINT Technology will be present with its Exhibition Booth at the 14th International Conference on Shot Peening which will take place in Milano from 4th – 7th September 2022.

The conference is a unique opportunity for researchers and industry representatives to present their scientific and technological developments on shot peening and surface treatments. From fatigue and fracture, modeling and simulation, to related and alternative surface treatments, ICSP-14 will cover a wide range of relevant topics for conventional and additive manufacturing technology.

New possible applications of shot peening will be also presented, paving the way for new markets for the treatment.

SINT Technology, in partnership with Pisa University, will also present the technical paper “X-Ray Diffraction and Hole-Drilling residual stress measurements of shot peening treatments validated on a calibration bench”.

For further information you can visit the official website

During 2022 and 2023 SINT Technology will be sponsored by the Italian Industry and Commerce Office in UAE on the online platform “Italian Yellow Directory in the Gulf”, as an example of excellence of the Italian industry. From now on, Customers in the Middle East interested in our services and products will be able to contact us not only through our website and email as usual, but also by reaching our representatives through the Yellow Directory and meet them in their office at Burj Gate, Dubai.

Find more about the Italian Yellow Directory in the Gulf at this website:

Accredia SINT ENG Certification


ASME PTC 4 Performance Test


In January 2021 the ASTM Commission has released a new version of the Standard Test Method for Determining Residual Stresses by the Hole-Drilling Strain-Gage Method, named ASTM E837-20.
The main update of this version is the introduction of the residual stress calculation both for uniform and non-uniform stress field also in case of intermediate thickness of the specimen under test.

For this reason SINT Technology has developed a new version of its Evaluation Software, fully compliant to the ASTM E837-20.

Main Features of EVAL 7.3

  • Introduction of the uniform stress calculation both for “Thick” and “Intermediate” thickness workpieces according to ASTM E837-20.
  • Introduction of the non-uniform stress calculation both for “Thick” and “Intermediate” thickness workpieces according to ASTM E837-20.
  • Extension of the main EVAL Software features (Viewers, Report and Uncertainty) to the new ASTM calculation algorithms.

More details about EVAL Software

A new version of the ASTM E837 method for the strain-gage hole-drilling residual stress measurement has been recently released by the ASTM commission. The new version, dated 2020, supersedes the old one released during the 2013.

Additional information can be found in the dedicated page of the ASTM E837-20 standard (

The main improvements of this new version of the standard are related to the residual stress calculation mainly in case of intermediate depth: this is an important issue in order to extend the capability of the hole drilling method also to low-thickness metal sheets.

The implementation of the intermediate calculation case is done both for uniform and not-uniform residual stress distributions.

The practical steps of the hole drilling measurement remain the same as in the past and for this reason the MTS3000-Restan System is still fully compliant with the new version of the standard.

SINT Technology is still working on the ASTM E837-20 in order to prepare an updated version of the EVAL software and the ISO/IEC 17025 accreditation of its laboratory according to this new version of the standard.

Further information can be found on the page dedicated to the standard (

COVID-19 is changing many aspects of our life and work. Due to restrictions in travelling, in-site measurement campaigns are strongly limited. For this reason SINT Technology has decided to offer its measurement services and plant performance assessments even in a new remotely assisted mode. 

Our technicians will follow you step by step from the installation of the instrumentation and software configuration up to the sending of data for their processing.

Contact us for more information!